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| Philips Semiconductors Product specification Rectifier diodes schottky barrier GENERAL DESCRIPTION Dual, low leakage, platinum barrier, schottky barrier rectifier diodes in a full pack, plastic envelope featuring low forward voltage drop and absence of stored charge. These devices can withstand reverse voltage transients and have guaranteed reverse surge capability. The devices are intended for use in switched mode power supplies and high frequency circuits in general where low conduction and zero switching losses are important. PBYR3045PTF series QUICK REFERENCE DATA SYMBOL VRRM VF IO(AV) PARAMETER PBYR30Repetitive peak reverse voltage Forward voltage Output current (both diodes conducting) MAX. MAX. MAX. 45PTF 45 0.65 20 UNIT V V A 35PTF 40PTF 35 40 0.65 20 0.65 20 PINNING - SOT199 PIN 1 2 3 DESCRIPTION anode 1 (a) cathode (k) anode 2 (a) PIN CONFIGURATION case SYMBOL a1 1 k2 1 2 3 a2 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL VRRM VRWM VR IO(AV) IO(RMS) IFRM IFSM PARAMETER CONDITIONS MIN. -35 35 35 35 MAX. -40 40 40 40 20 20 30 135 150 -45 45 45 45 UNIT V V V A A A A A Repetitive peak reverse voltage Crest working reverse voltage Continuous reverse voltage Ths 113 C Output current (both diodes conducting) RMS forward current Repetitive peak forward current per diode Non-repetitive peak forward current per diode. square wave; = 0.5; Ths 109 C I2t IRRM IRSM Tstg Tj t = 25 s; = 0.5; Ths 109 C t = 10 ms t = 8.3 ms sinusoidal; Tj = 125 C prior to surge; with reapplied VRWM(max) I2t for fusing t = 10 ms Repetitive peak reverse current tp = 2 s; = 0.001 per diode. Non-repetitive peak reverse tp = 100 s current per diode. Storage temperature Operating junction temperature -65 - 91 2 2 175 150 A2s A A C C August 1996 1 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes schottky barrier ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 C unless otherwise specified SYMBOL Visol PARAMETER Repetitive peak voltage from all three terminals to external heatsink CONDITIONS R.H. 65 % ; clean and dustfree PBYR3045PTF series MIN. - TYP. MAX. 2500 UNIT V Cisol Capacitance from T2 to external f = 1 MHz heatsink - 22 - pF THERMAL RESISTANCES SYMBOL Rth j-hs Rth j-a PARAMETER Thermal resistance junction to heatsink Thermal resistance junction to ambient CONDITIONS per diode both diodes (with heatsink compound) in free air. MIN. TYP. 35 MAX. 4.0 3.5 UNIT K/W K/W K/W STATIC CHARACTERISTICS Tj = 25 C unless otherwise stated SYMBOL VF IR Cd PARAMETER Forward voltage (per diode) Reverse current (per diode) Junction capacitance (per diode) CONDITIONS IF = 30 A; Tj = 125C IF = 20 A; Tj = 125C IF = 30 A VR = VRWM VR = VRWM; Tj = 125 C f = 1MHz; VR = 5V; Tj = 25 C to 125 C MIN. TYP. 0.70 0.58 0.75 100 12 800 MAX. 0.75 0.65 0.80 200 40 UNIT V V V A mA pF August 1996 2 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes schottky barrier PBYR3045PTF series 15 PF / W Vo = 0.3020 V Rs = 0.0139 Ohms PBYR1645F 0.5 0.2 Ths(max) / C D = 1.0 90 IR / mA 100 150 C 10 PBYR1645 10 0.1 110 1 125 C 100 C 5 I tp D= tp T t 130 0.1 75 C Tj = 50 C T 0.01 0 0 5 10 15 IF(AV) / A 20 150 25 0 25 VR/ V 50 Fig.1. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x D. PF / W Vo = 0.302 V Rs = 0.0139 Ohms Fig.4. Typical reverse leakage current per diode; IR = f(VR); parameter Tj 14 12 10 8 6 4 2 0 PBYR1645F Ths(max) / C a = 1.57 2.2 1.9 84 92 110 118 Cd / pF 10000 PBYR1645 4 2.8 1000 126 134 142 0 5 IF(AV) / A 10 150 15 100 1 10 VR / V 100 Fig.2. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). IF / A Tj = 25 C Tj = 125 C 40 PBYR1645 typ Fig.5. Typical junction capacitance per diode; Cd = f(VR); f = 1 MHz; Tj = 25C to 125 C. 50 Zth j-hs (K/W) max 10 1 30 20 0.1 10 P D tp t 0 0.01 0 0.2 0.4 0.6 0.8 VF / V 1 1.2 1.4 10us 1ms tp / s 0.1s 10s Fig.3. Typical and maximum forward characteristic IF = f(VF); parameter Tj Fig.6. Transient thermal impedance per diode; Zth j-hs = f(tp). August 1996 3 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes schottky barrier MECHANICAL DATA Dimensions in mm Net Mass: 5.5 g PBYR3045PTF series 15.3 max 0.7 7.3 3.1 3.3 6.2 5.8 21.5 max 3.2 5.2 max o 45 seating plane 3.5 3.5 max not tinned 15.7 min 1 2.1 max 2 3 1.2 1.0 5.45 0.7 max 0.4 M 2.0 5.45 Fig.7. SOT199; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". August 1996 4 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes schottky barrier DEFINITIONS Data sheet status Objective specification Product specification Limiting values PBYR3045PTF series This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1996 5 Rev 1.100 |
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